THICK WINDOW LAYER LED MANUFACTURE
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Oct 18, 2011
filing date -
Oct 18, 2011
priority date (Note) -
Abandoned
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Abstract
A LED die and method for bonding, dicing, and forming the LED die are disclosed. In an example, the method includes forming a LED wafer, wherein the LED wafer includes a substrate and a plurality of epitaxial layers disposed over the substrate, wherein the plurality of epitaxial layers are configured to form a LED; bonding the LED wafer to a base-board to form a LED pair; and after bonding, dicing the LED pair, wherein the dicing includes simultaneously dicing the LED wafer and the base-board, thereby forming LED dies.
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