LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Oct 13, 2011
filing date -
Oct 13, 2011
priority date (Note) -
Abandoned
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Abstract
A leadframe includes a die pad and a protective wall surrounding the die pad. A semiconductor die is situated on the die pad. Indentations are formed on the four inner corners of the protective wall adjacent the corners of the semiconductor die.
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