WAFER LEVEL APPLIED RF SHIELDS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130093067A1
SERIAL NO

13648166

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An embodiment of a method of forming an on-chip RE shield on an integrated circuit chip in accordance with the present disclosure includes providing a wafer level integrated circuit component wafer having a front side and a back side before singulation; applying a resin metal layer on a back side of the wafer; and then separating the wafer into discrete RF shielded components. It is this resin metal layer on the back side that acts effectively as the RF shield, after singulation, i.e. separation of the wafer, into discrete RF shielded components.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
FLIPCHIP INTERNATIONAL LLC3701 E UNIVERSITY DR PHOENIX AS 85034

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clark, David Ipswich, GB 167 2441
Tessier, Theodore G Chandler, US 12 536

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation