BONDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Oct 11, 2012
filing date -
Oct 14, 2011
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Abandoned
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Abstract
A bonded substrate having a plurality of grooves and a method of manufacturing the same. The method includes the following steps of implanting ions into a first substrate, thereby forming an ion implantation layer, bonding the first substrate to a second substrate having a plurality of grooves in one surface thereof such that the first substrate is bonded to the one surface, and cleaving the first substrate along the ion implantation layer.
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