EMBEDDED MULTILAYER PRINTED CIRCUIT BOARD AND METHOD
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
May 16, 2012
filing date -
Oct 14, 2011
priority date (Note) -
Abandoned
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Abstract
An embedded multilayer printed circuit board includes first, second and third circuit substrates, and a flexible circuit substrate. The first circuit substrate includes a first base layer and a first electrically conductive layer. The second circuit substrate includes a second base layer and a second circuit layer. The second circuit substrate also defines a receiving hole. The third circuit substrate includes a third circuit layer, a third base layer, a fourth circuit layer, and an electronic element mounted on the third circuit layer. The third circuit layer and the fourth circuit layer are formed on the opposite sides of the third base layer. The electronic element is received in the receiving hole.
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