METHOD OF FABRICATING ELECTRONIC DEVICE HAVING FLEXIBLE DEVICE
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United States of America Patent
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Issued Date -
Apr 11, 2013
app pub date -
Oct 6, 2012
filing date -
Oct 6, 2011
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Abandoned
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Abstract
There is provided a method of fabricating an electronic device having a flexible device, which is fabricated using a support substrate by Joule-heating induced film separation (JIFS). A method of fabricating an electronic device having a flexible device includes providing a support substrate, coating a conductive layer on one surface of the support substrate, forming a plastic substrate on the other surface of the support substrate, forming one or more thin-film transistors (TFTs) on the plastic substrate, forming an electronic device electrically connected to any one of the TFTs, and separating the plastic substrate from the conductive layer by generating Joule-heating through application of an electric field to the conductive layer. Accordingly, the flexible device can be separated from the support substrate without deformation of the support substrate and degradation of the electronic device. Since the separation time is short, it is easy to fabricate a large-area device, and the fabrication yield can be improved.
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