PLASMA-ENHANCED DEPOSITION OF NICKEL-CONTAINING FILMS FOR VARIOUS APPLICATIONS USING AMIDINATE NICKEL PRECURSORS

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United States of America Patent

APP PUB NO 20130089678A1
SERIAL NO

13269115

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Abstract

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The disclosure relates to a process for depositing a Nickel or Cobalt containing film comprising the step of providing a metal guanidinate and/or metal amidinate precursor, suitable for plasma deposition at temperature equal or lower than 500 degrees C., to a plasma deposition process comprising a deposition temperature equal or lower than 500 degrees C.

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Patent Owner(s)

Patent OwnerAddress
AMERICAN AIR LIQUIDE INC46409 LANDING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DUSSARRAT, Christian Wilmington, US 139 7373
LANSALOT-MATRAS, Clement Tsukuba, JP 21 80
OMARJEE, Vincent M Grenoble, FR 29 485

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  • 2 Citation Count
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  • 7.13 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7960820884433417136241001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650

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