Communication System in a Package Formed on a Metal Microstructure
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United States of America Patent
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Issued Date -
Apr 11, 2013
app pub date -
Oct 11, 2011
filing date -
Oct 11, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus includes a metal frame, a switching power circuit, and at least one semiconductor die implementing a communication interface. The metal frame includes a plurality of external pads, and a plurality of base pads coupled to selected external pads. The switching power circuit is mounted to selected base pads and includes an input terminal, an output terminal, an energy storage device mounted to a first subset of the base pads and coupled to the output terminal, and a switching element mounted to a second subset of the base pads and coupled to the input terminal and the energy storage element. The at least one semiconductor die provides a control signal to the switching device to control an output voltage present at the output terminal.
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