Method and Device for Forming Solder Deposits
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United States of America Patent
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app pub date -
Apr 13, 2011
filing date -
Apr 16, 2010
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Abstract
The invention relates to a method for forming solder deposits (34) on elevated contact metallizations (24) of terminal faces (23) of a substrate (19) formed in particular as a semiconductor component, in which wetting surfaces (26) of the contact metallizations are brought into physical contact with a solder material layer (15) arranged on a solder material carrier (13), at least for the duration of the physical contact a heating of the substrate and a tempering of the solder material layer takes place, and subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
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