HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Apr 11, 2013
app pub date -
Oct 10, 2011
filing date -
Oct 10, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed.
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