RADIATION CURED REINFORCEMENT STACKS
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United States of America Patent
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Issued Date -
Apr 11, 2013
app pub date -
Mar 3, 2011
filing date -
Apr 14, 2010
priority date (Note) -
Abandoned
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Abstract
In one aspect, the present disclosure relates to a method to bond fiber reinforced polymer composite tape layers to make reinforcement stacks. The method includes collecting a plurality of composite tape layers to form a reinforcement stack, helically winding the reinforcement stack; and curing an adhesive on one or more surfaces of the plurality of composite tape layers by exposing the reinforcement stack to radiation. In another aspect, the present disclosure relates to a method to bond fiber reinforced polymer composite reinforcement stacks. The method includes collecting a plurality of composite tape layers each comprising at least one resin-rich surface to form a reinforcement stack, helically winding the reinforcement stack, and bonding the reinforcement stack by exposing the reinforcement stack to radiation. In another aspect, the present disclosure relates to an apparatus to bond polymer composite reinforcement stacks.
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