Method Of Manufacturing Package-On-Package (Pop)
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Sep 26, 2012
filing date -
Sep 30, 2011
priority date (Note) -
Abandoned
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Abstract
A method of manufacturing package-on-packages (POPs) includes: forming a plurality of internal connection members that are separated from each other on a first circuit substrate; forming a first package by attaching a plurality of first chips between the internal connection members on the first circuit substrate; forming a second package by attaching a plurality of second chips that are separated from each other on a second circuit substrate; electrically connecting the first circuit substrate and the second circuit substrate by stacking the internal connection members onto the second circuit substrate; forming an encapsulant to encapsulate the first package and the second package; and forming the POPs in which the first chips and the second chips are respectively formed by cutting the first circuit substrate, the second circuit substrate, and the encapsulant.
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