SUBSTRATE PROCESSING METHOD
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Mar 22, 2012
filing date -
Sep 29, 2011
priority date (Note) -
Abandoned
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Abstract
According to one embodiment, a substrate processing apparatus is provided, in which a solvent is supplied onto a surface of a substrate having trenches made in a surface, and the substrate is rotated while a solvent holding member made of plastic material is contacting the surface of the substrate, whereby the surface of the substrate and the solvent holding member slide on each other.
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