SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20130083570A1
SERIAL NO

13597564

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Abstract

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A semiconductor device includes a first element structure that includes a charge supply layer of first polarity; a charge channel layer of second polarity, the charge channel layer being formed above the charge supply layer and including a recess portion; and a first electrode formed in the recess portion above the charge channel layer.

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Patent Owner(s)

Patent OwnerAddress
TRANSPHORM JAPAN INCSHIN-YOKOHAMA CENTER BLDG 9F 2-5-15 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA KANAGAWA 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imada, Tadahiro Kawasaki, JP 65 1181

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