THREE-DIMENSIONAL ELECTRONICS PACKAGING
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Oct 4, 2012
filing date -
Oct 4, 2011
priority date (Note) -
Abandoned
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Abstract
Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit assembly (PCA), or co-accommodated in adjoining cavities of adjacent, stacked PCAs or PCBs. The cavities allow for closer stacking of the PCAs or PCBs. In some embodiments, a PCA comprises an encapsulant conformally layered over a PCB with electronic components mounted on top and bottom. Power and/or signal channels are routed through the encapsulant to the top and/or bottom layers. The encapsulated PCAs may be stacked. In various embodiments, stackable PCAs are modular, facilitating customization.
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