SERIAL PLATING SYSTEM
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Sep 25, 2012
filing date -
Sep 29, 2011
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Abstract
A serial plating system includes a plating tank that receives a plating solution, a plurality of workpieces that are serially transferred along a transfer path being simultaneously plated in the plating tank, a common cathode that is electrically connected to the plurality of workpieces via a plurality of transfer jigs that respectively hold the plurality of workpieces, a plurality of split anodes that are disposed in the plating tank so as to face the transfer path, and a plurality of power supplies that are respectively connected to a corresponding split anode among the plurality of split anodes and the common cathode, and independently control current supplied to the corresponding split anode among the plurality of split anodes.
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