Wafer Carrier with Flexible Pressure Plate
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Sep 23, 2011
filing date -
Sep 23, 2011
priority date (Note) -
Abandoned
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Abstract
A wafer carrier with a wafer mounting plate disposed under a plenum which can be pressurized and depressurized to alter the shape of the wafer mounting plate and a plenum, formed with the wafer mounting plate and the wafer itself, to which vacuum can be applied to hold the wafer to the wafer mounting plate during polishing
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