METHOD OF SEGMENTING AND PACKAGING IRRADIATED COMPONENTS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 28, 2013
app pub date -
Sep 13, 2012
filing date -
Sep 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of segmenting and packaging an irradiated hardware component for storage or shipment. Radiological and physical characteristics of the components are first mapped over its surface. A segmenting plan and a loading plan is then determined that sets forth where over the surface of the components lateral segments are to be made from a map obtained from the mapping step taken into consideration any licensing restrictions and requirements of the facility in which the casks is to be stored with the view to maximizing the loading of the casks. The irradiated components are then segmented in accordance with the segmenting plan and loaded into the casks in accordance with the loading plan.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully