INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Sep 23, 2011
filing date -
Sep 23, 2011
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate first side and a substrate second side opposite the substrate first side; attaching a base integrated circuit to the substrate first side; attaching a mountable integrated circuit to the substrate second side; attaching a via base to the substrate second side adjacent the mountable integrated circuit; forming a device encapsulation surrounding the via base and the mountable integrated circuit; and forming a via extension through the device encapsulation and attached to the via base, the via extension exposed from the device encapsulation.
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