MEMORY CARD PACKAGE WITH A SMALL SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Sep 23, 2011
filing date -
Sep 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a memory card package with a small substrate by using a metal die pad having an opening to substitute the chip-carrying function of a conventional substrate so that substrate dimension can be reduced. A substrate is attached under the metal die pad. A first chip is disposed on the substrate located inside the opening. A second chip is disposed on the metal die pad without covering the opening. A card-like encapsulant encapsulates the metal die pad, the top surface of the substrate, the first chip, and the second chip. The dimension of the substrate is smaller than the dimension of the encapsulant. The substrate has a lumpy sidewall encapsulated by the encapsulant so that the bottom surface of the substrate is coplanar with a bottom side of the encapsulant to increase the adhesion between the substrate and the encapsulant.
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