FLIP-CHIP BONDED IMAGER DIE
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Aug 20, 2012
filing date -
Aug 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer.
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