OPTICAL MODULE PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Nov 3, 2011
filing date -
Sep 27, 2011
priority date (Note) -
Abandoned
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Abstract
An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on the periphery of the first cavity, two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively, and a lid integrally formed on the substrate to enhance the airtightness of the whole optical module package structure.
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