METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Sep 4, 2012
filing date -
Sep 15, 2011
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Abandoned
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Abstract
A method of simultaneous double-side polishing of a front side and a rear side of at least one wafer composed of semiconductor material includes disposing each wafer in a respective suitably dimensioned cutout in a carrier plate. The at least one wafer is polished on the front side and on the rear side between an upper polishing plate covered with a first polishing pad and a lower polishing plate covered with a second polishing pad while supplying a polishing agent. A respective surface of each of the first and second polishing pads is interrupted by at least one respective channel-shaped depression running spirally from a center to an edge of the respective pad.
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