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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Dec 20, 2011
filing date -
Dec 21, 2010
priority date (Note) -
Abandoned
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Abstract
A prepreg comprising a single structural layer of electrically conductive unidirectional fibers and a first outer layer of curable resin substantially free of structural fibers, and optionally a second outer layer of curable resin substantially free of structural fibers, the sum of the thicknesses of the first and second outer resin layers at a given point having an average of at least 10 micrometers and varying over at least the range of from 50% to 120% of the average value, and wherein the first outer layer comprises electrically conductive particles.
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