FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Jul 26, 2012
filing date -
Sep 15, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip-chip package structure comprising a substrate, a chip, a bump structure and a solder resist is provided. The substrate has a circuit layer disposed on the surface thereof. The chip comprises a central region and two edge regions disposed on the two sides of the central region. The bump structure is disposed on the central region of the chip and faces the substrate. The solder resist is disposed on the substrate to partially cover the circuit layer. The chip is electrically connected to the substrate by the bump structure, and the solder resist is adapted to come into contact with the two edge regions of the chip to support the chip with the bump structure when the chip is disposed on the substrate.
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