FLASH MEMORY CARD WITHOUT A SUBSTRATE AND ITS FABRICATION METHOD
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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Sep 16, 2011
filing date -
Sep 16, 2011
priority date (Note) -
Abandoned
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Abstract
Disclosed is a flash memory card without a substrate, primarily comprising a memory chip component, a controller chip disposed on the memory chip, and an encapsulant encapsulating both chips. Formed on an active surface and a back surface of the memory chip component are a first RDL (redistribution layer) and a second RDL respectively. A plurality of TSVs (through silicon vias) penetrate from the active surface to the back surface to electrically connect both RDLs. A plurality of contacting fingers are disposed on the back surface of the memory chip component and electrically connected with the second RDL. Additionally, the encapsulant has a card appearance with one surface of each contacting finger to be exposed. Accordingly, the flash memory card can save conventional substrate structure with better reliability and efficiency for packaging processes.
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