HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Sep 20, 2011
filing date -
Sep 20, 2011
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Abandoned
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Abstract
The integrated circuit packaging techniques of the disclosed embodiments utilize a thermally conductive heat sink to partially enclose an integrated circuit. The heat sink is separated from the integrated circuit by a substrate that is conformally positioned into a recess in the heat sink, enabling the heat sink to transfer thermal energy from the integrated circuit.
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