Die Bonder and Bonding Method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Mar 9, 2012
filing date -
Sep 15, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.
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