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Abstract

Provided are novel building integrable interconnection structures having field-configurable shapes and methods of installing thereof. An interconnection structure may be cut or otherwise modified in the field during installation to form one or more openings. These openings can then be positioned around various obstacles that are frequently present in building installation areas. Some examples of such obstacles include chimneys, vents, and skylights. In some embodiments, the interconnection structures can be provided as part of a set or configured to be installed in an array with building integrable photovoltaic (BIPV) modules of the same size. This installation configuration allows preserving an offset between adjacent rows of the array. Furthermore, the interconnection structures can have the same perimeter features as the BIPV modules, such as electrical connectors and moisture flaps. These features provide electrical continuity and sealing characteristics in an array of BIPV modules despite the presence of obstacles on building structures.

First Claim