MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER
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United States of America Patent
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Issued Date -
Mar 14, 2013
app pub date -
Oct 21, 2011
filing date -
Sep 9, 2011
priority date (Note) -
Abandoned
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Abstract
A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface of the ceramic base.
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