Method for Producing Wafer Lens
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United States of America Patent
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Issued Date -
Mar 14, 2013
app pub date -
Apr 28, 2011
filing date -
May 27, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for producing a wafer lens provided with a lens portion made of a photo-curable resin on one face of a substrate. The method includes a dispensing step, a curing step and a releasing step. In the dispensing step, a photo-curable resin material is dispensed on at least one of (i) a mold having a molding surface in a shape corresponding to an optical surface shape of the lens portion and (ii) the one face of the substrate. The photo-curable resin material has a viscosity of 10000 cP or more at 25° C. In the dispensing step, the photo-curable resin material is heated so that the viscosity of the photo-curable resin material becomes between 1000 cP and 10000 cP, and dispensed.
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