SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE
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United States of America Patent
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N/A
Issued Date -
Mar 14, 2013
app pub date -
Aug 27, 2012
filing date -
Sep 8, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Wire spools used for multiple wire saws for slicing one or more wafers from a workpiece composed of semiconductor material using a wire web including parallel wire sections coated with bonded abrasive grain. The wire spools include a first wire spool configured as a dispensing spool and a second wire spool configured as a receiver spool. A sawing wire coated with bonded abrasive grain runs from the first wire spool via at least one deflection roll to the wire web and from the wire web via at least one deflection roll to the second wire spool. The sawing wire enters into guide grooves of the deflection rolls at an alignment angle α1 and exits the guide grooves of the deflection rolls at an alignment angle α2. The sawing wire has a single layer winding on each of the first and second wire spools.
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