HEAT TRANSFER INTERFACE
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United States of America Patent
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Issued Date -
Mar 7, 2013
app pub date -
Jan 12, 2011
filing date -
Jan 12, 2010
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Embodiments of the invention provide systems and methods for heat management systems at temperatures in the range of 120° C. to 1,300° C. The systems consist of various heat transfer chambers configured such that they contain heat transfer devices that are spherical, cylindrical or have other shapes, and that absorb heat within a broad range of temperatures, and return such heat at constant temperature over long periods of time.
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