INTEGRATED SEMICONDUCTOR-PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Mar 7, 2013
app pub date -
May 6, 2011
filing date -
May 7, 2010
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Abandoned
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Abstract
The present invention relates to an integrated semiconductor-processing apparatus including: an integrated semiconductor-processing body which has a first space for storing a plurality of FOUPs containing a plurality of wafers, and a second space in which a processing device is installed to process the wafers stored in the first space; a load port module installed in the first space of the integrated semiconductor-processing body to open the FOUPs to enable extraction of wafers from the FOUPs; and a transfer device which extracts wafers from the FOUPs and transfers the wafers to the processing device in the second space.
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