COMPOSITION FOR CLEANING SUBSTRATES POST-CHEMICAL MECHANICAL POLISHING
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United States of America Patent
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Issued Date -
Feb 28, 2013
app pub date -
Aug 22, 2011
filing date -
Aug 22, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor processing composition and method for cleaning semiconductor wafers post chemical mechanical polishing comprising a phosphorous base and optionally at least one surfactant.
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