NANO-SEEDING VIA DUAL SURFACE MODIFICATION OF ALKYL MONOLAYER FOR SITE-CONTROLLED ELECTROLESS METALLIZATION
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United States of America Patent
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Issued Date -
Feb 28, 2013
app pub date -
Aug 24, 2011
filing date -
Aug 24, 2011
priority date (Note) -
Abandoned
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Abstract
Self-assembled-monolayer grafted seeding and electroless plating processes for patterning of metal-alloy thin films, comprising the steps of treating the surface of the substrate by organic species, covering the organic species-SAM coated surface of dielectric substrate with a template, treating the surface by vacuum plasma, immersing the substrate into an aqueous solution, removing the hydrogen from the surface of the substrate, immersing the negatively charged dielectric surface into an aqueous metal salt solutions for adsorbing metal ions, reducing the positively charged metallic cations into neutral metal particles which act as catalysts by a reducing agent, and immersing the dielectric substrate into an electroless-plating solution for deposition of metal and metal-alloy thin film patterns.
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