Backlight Module with Connecting Circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130051067A1
SERIAL NO

13220681

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a backlight module with connecting circuits, comprising: at least one main circuit lay, a first connecting circuit layer and a second connecting circuit layer, wherein the first connecting circuit layer and the second connecting circuit layer can be connected with the main circuit layer by way of a second time welding process, therefore the total circuit area of the backlight module is increased. Moreover, in the backlight module with connecting circuits, a plurality of first holes are form on a housing, and the first holes sink from the outer surface to the inner surface of the housing bottom, such that each of the LED chips are snugly covered by the inner walls of the first holes when they respectively enter the first holes; Therefore, when the LED chips emit the light, the heat produced by each of the surfaces of the LED chips can be rapidly conducted to the housing via the inner walls of the first holes, and then the heat may be dissipated through the housing.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
KOCAM INTERNATIONAL CO LTD8F NO 82-8 SEC 1 KUANG-FU RD SANCHUNG CITY TAIPEI HSENG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Tsan-Jung New Taipei City, TW 20 101

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