SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130048360A1
SERIAL NO

13497881

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Method for providing a printed circuit board (16) with an electronic device (1), wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for heat dissipation is soldered with the soldering pad (11) onto a printed circuit board substrate of the printed circuit board (16) such that the electronic device (1) is electrically connected to an electrical circuit provided on the printed circuit board substrate, wherein prior to soldering, one or more through holes (12) are provided in the printed circuit board in the area where the soldering pad (12) is to be soldered to the printed circuit board (16) such that the through hole is provided for allowing flux gasses resulting during soldering of the electronic device (1) to the printed circuit board to escape.

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Patent Owner(s)

Patent OwnerAddress
OPTIONKOLONEL BEGAULTLAAN 45 LEVEN B-3012

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Vandebril, Stijn Kessel-Lo, BE 2 0

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