HEAT DISSIPATION DEVICE
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United States of America Patent
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N/A
Issued Date -
Feb 28, 2013
app pub date -
Aug 30, 2011
filing date -
Aug 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation device includes a housing, a fan mounted within the housing, a fin assembly fixed to the housing and heat pipes attached on the fin assembly. The housing includes a panel and a sidewall extending upwardly from a periphery of the panel. The fin assembly includes first fins and second fins alternately arranged on the panel. The first fins and the second fins each include a plate, an upper flange and a lower flange extending from a top side and a bottom side of the plate, respectively. Each second fin defines a slot in a lateral side of the plate thereof adjacent to the fan. Every two adjacent first fin and second fin define a channel therebetween. Two adjacent channels communicate with each other at inlets thereof via the slot, and separated from each other at outlets thereof via a second fin.
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