METHOD OF ELIMINATING FRAGMENTS OF MATERIAL PRESENT ON THE SURFACE OF A MULTILAYER STRUCTURE
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United States of America Patent
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Issued Date -
Feb 21, 2013
app pub date -
Feb 7, 2011
filing date -
Feb 26, 2010
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Abandoned
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Abstract
The invention relates to a method of eliminating fragments of material present on the exposed surface of a first wafer bonded to a second wafer, the method including a step consisting of placing the first wafer in a liquid solution and propagating ultrasonic waves in the solution. The invention also relates to a process for manufacturing a multilayer structure comprising the following successive steps: bonding of a first wafer to a second wafer so as to form a multilayer structure; annealing of the structure; and thinning of the first wafer, including at least one step of chemically etching the first wafer. The process further includes, after the chemical etching step, the elimination of fragments of material present on the exposed surface of the thinned first wafer.
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