Dual Cure Thermally Conductive Adhesive
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United States of America Patent
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Issued Date -
Feb 21, 2013
app pub date -
Aug 16, 2011
filing date -
Aug 16, 2011
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Abstract
A thermally conductive adhesive for use in connection with heat-generating electronic components includes an unsaturated carbonyl containing compound combined with a thiol containing compound blended with thermally conductive fillers. The adhesive is fully curable with UV light exposure or within 48 hours at room temperature. The combination of the two different cure methods in this adhesive facilitates rapid and energy efficient manufacturing.
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