Method for Marking a Socket
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United States of America Patent
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Issued Date -
Feb 21, 2013
app pub date -
Aug 16, 2011
filing date -
Aug 16, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a method for marking a socket. The method includes the steps of providing a socket, making at least one indented mark in the surface of the socket, executing a heat treatment on the surface of the socket, providing at least one colored layer in the indented mark, providing an electroplated layer on the surface of the socket except the colored layer, removing a portion of the electroplated layer from the surface of the socket to form an exposed portion of the surface of the socket, and providing a black-dyed layer on the exposed portion of the surface of the socket. The heat treatment can be executed after the colored layer is provided.
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