VDMOS DEVICE AND METHOD FOR FABRICATING THE SAME

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United States of America Patent

SERIAL NO

13695013

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Abstract

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A method for fabricating VDMOS devices includes providing a semiconductor substrate; forming a first N-type epitaxial layer on the semiconductor substrate; forming a hard mask layer with an opening on the first N-type epitaxial layer; etching the first N-type epitaxial layer along the opening until the semiconductor substrate is exposed, to form P-type barrier figures; forming a P-type barrier layer in the P-type barrier figures, the P-type barrier layer having a same thickness as that of the first N-type epitaxial layer; removing the hard mask layer; forming a second N-type epitaxial layer on the first N-type epitaxial layer and the P-type barrier layer; forming a gate on the second N-type epitaxial layer; forming a source in the second N-type epitaxial layer on both side of the gate; and forming a drain on the back of the semiconductor substrate relative to the gate and the source.

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Patent Owner(s)

Patent OwnerAddress
CSMC TECHNOLOGIES FAB1 CO LTDNO 8 XINZHOU ROAD WUXI NEW DISTRICT JIANGSU 214028
CSMC TECHNOLOGIES FAB2 CO LTD214028 NO 8 XINZHOU ROAD NATIONAL HI TECH INDUSTRIAL DEVELOPMENT ZONE WUXI JIANGSU WUXI CITY JIANGSU PROVINCE 214028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Le Wuxi City, CN 234 1886

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