LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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app pub date -
Oct 17, 2012
filing date -
Sep 29, 2010
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Abandoned
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Abstract
A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.
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