EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

United States of America Patent

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Issued Date
Feb 14, 2013
app pub date
May 2, 2011
filing date
May 7, 2010

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Abstract

Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.

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Patent Owner(s)

Patent Owner	Address
SUMITOMO BAKELITE CO LTD	5-8 HIGASHI-SHINAGAWA 2-CHOME SHINAGAWA-KU TOKYO 140-0002

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Inventor Name	Address	# of filed Patents	Total Citations
Endo, Tadasuke	Tokyo, JP	8	54
Kimura, Michio	Tokyo, JP	39	462
Tanaka, Nobuki	Tokyo, JP	22	158

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EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13642944

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SERIAL NO	13642944
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13642944

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