WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Feb 7, 2013
app pub date -
Mar 12, 2012
filing date -
Aug 9, 2010
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a wafer level package is provided that enables suppressing the wearing of a cutter and extending the lifetime of the cutter, including forming insulating first resin over the top face of a substrate, which includes a groove for wiring to be formed; forming a film of first metal that is to serve as a portion of the wiring on the top face of the first resin using physical vapor deposition; forming a film of second metal that is to form a portion of the wiring on the top face of the first metal, with a lower hardness than the first metal; setting a cutter at a height corresponding to a place where the film of the first metal is not formed on a side face of the groove or the film thickness is low; and cutting at least the first resin by scanning the cutter.
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