Substrate-Molding Apparatus
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United States of America Patent
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Issued Date -
Feb 7, 2013
app pub date -
Sep 20, 2011
filing date -
Aug 4, 2011
priority date (Note) -
Abandoned
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Abstract
Disclosed is a substrate-molding apparatus. The substrate-molding apparatus includes a shell, a mold movably located in the shell, an upper pressing disc movably located in the mold, and a lower pressing disc movably located in the mold. The shell includes an internal space defined therein and two open ends in communication with the internal space. The mold includes an internal space defined therein. The upper pressing disc includes at least one cutout defined in the edge thereof. Powder is filled in the internal space of the mold. The powder is pressed and molded by the upper pressing disc driven by hydraulic pressure. The molded product is removed from the mold by hydraulic pressure. Thus, the removal of the molded product from the mold is easy and fast. The yield is high. Moreover, the substrate-molding apparatus can be used repeatedly.
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