HEAT DISSIPATION MODULE AND LED ILLUMINATION DEVICE USING THE SAME

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United States of America Patent

APP PUB NO 20130033878A1
SERIAL NO

13216270

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Abstract

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A heat dissipation module includes a plurality of fins. Each fin includes a main body, a bottom bending plate bending from a bottom edge of the main body, a top bending plate bending from a top edge of the main body, and a slick flange folding inwards from an outer edge of the main body. The flange overlaps the main body at the outer edge of a corresponding fin. The present disclosure also relates to an LED illumination device using the heat dissipation module.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI
FURUI PRECISE COMPONENT (KUNSHAN) CO LTDNO 635 FOXCONN ROAD HI-TECH INDUSTRY PARK DEVELOPMENT DISTRICT KUNSHAN CITY JIANGSU PROVINCE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUNG, JUI-WEN Tu-Cheng, TW 43 562
HWANG, CHING-BAI Tu-Cheng, TW 105 1952
XIA, BEN-FAN KunShan City, CN 23 110

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