FILM THICKNESS MEASUREMENT APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130033698A1
SERIAL NO

13537055

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is a film thickness measurement apparatus including a light source, a first optical path, a first condenser lens, a spectrometry unit, a second optical path, a second condenser lens, and a data processing unit. The light source emits measurement light having a predetermined wavelength range. The first optical path guides to an object to be measured the measurement light. The first condenser lens condenses the measurement light. The spectrometry unit obtains a wavelength distribution characteristic of reflectance or transmittance. The second optical path guides to the spectrometry unit the light reflected by or transmitted through the object. The second condenser lens condenses light at an end of the second optical path. The data processing unit analyzes the wavelength distribution characteristic obtained in the spectrometry unit to obtain a film thickness of the object.

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Patent Owner(s)

Patent OwnerAddress
OTSUKA ELECTRONICS CO LTDJAPAN'S OSAKA TIAN RECRUIT MENTION HIRAKATA LAST THREE 26 TIMES 3 CHOME HIRAKATA-SHI OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIMORI, Tadayoshi Ritto-shi, JP 2 26

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