THERMAL SOLUTION WITH SPRING-LOADED INTERFACE
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United States of America Patent
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Issued Date -
Feb 7, 2013
app pub date -
May 23, 2012
filing date -
Aug 3, 2011
priority date (Note) -
Abandoned
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Abstract
Thermal solution systems including a heat sink and a spreader plate mounted to the heat sink via one or more springs. Thermal gap filler provides a thermal interface between the heat sink and the spreader plate. The one or more springs provide contact force between the heat spreader plate and a component to be cooled, while accommodating dimensional variation, such as manufacturing tolerance or assembly tolerance related variation.
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